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谢仕芳,韦习成,鞠国魁,徐可心.Sn3.0Ag0.5Cu0.05Cr/Cu焊点界面IMC层热时效形貌及生长行为研究[J].稀有金属材料与工程(英文),2015,44(9):2234~2239.[Xie Shifang,Wei Xicheng,Ju Guokui,Xu Kexin.Interfacial IMC Layer Morphology and Growth Behavior of Sn3.0Ag0.5Cu0.05Cr/Cu Solder Joints during Isothermal Aging[J].Rare Metal Materials and Engineering,2015,44(9):2234~2239.]
Interfacial IMC Layer Morphology and Growth Behavior of Sn3.0Ag0.5Cu0.05Cr/Cu Solder Joints during Isothermal Aging
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Received:September 17, 2014  
DOI:
Key words: SnAgCu  lead-free solder  chromium  intermetallic compound  thermal aging
Foundation item:江西省钨铜新材料重点实验室开放课题 (2010-WT-02)
Author NameAffiliation
Xie Shifang Institute of Applied Physics, Jiangxi Academy of Sciences, Nanchang 330029, China 
Wei Xicheng Shanghai University, Shanghai 200072, China 
Ju Guokui Shanghai University, Shanghai 200072, China 
Xu Kexin Shanghai University, Shanghai 200072, China 
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Abstract:
      The morphology and growth behavior of interfacial intermetallic compound (IMC) layer for the Sn3.0Ag0.5Cu0.05Cr (SACCr)/Cu joints after isothermal aging at 150 °C for 0, 168, 500 and 1000 h were investigated, and they were compared with Sn3.0Ag0.5Cu (SAC). The results show that the trace Cr dispersed or dissolved in SAC solder effectively inhibits the IMC layer growth at the interface of SACCr/Cu joints. The longer the aging time, the more obvious the inhibiting effect of Cr on the overgrowth of IMC layer of solder/Cu joints. The average thickness of IMC layer of SACCr/Cu solder joints is about 5.13 μm after aging for 1000 h, only 45% of that of the SAC/Cu solder joints.