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陆裕东,何小琦,恩云飞,王 歆,庄志强.P对Au/Ni/Cu焊盘与SnAgCu焊点焊接界面可靠性的影响[J].稀有金属材料与工程(英文),2009,38(3):477~480.[Lu Yudong,He Xiaoqi,En Yunfei,Wang Xin,Zhuang Zhiqiang.Influence of Phosphorus on Reliability of Interface between Au/Ni/Cu Pad and SnAgCu Solder Joint[J].Rare Metal Materials and Engineering,2009,38(3):477~480.]
Influence of Phosphorus on Reliability of Interface between Au/Ni/Cu Pad and SnAgCu Solder Joint
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Received:March 11, 2008  
DOI:
Key words: Electroless Nickel/Immersion Gold  surface finish  SnAgCu  solder  intermetallic compound
Foundation item:“十一五”总装备部预研项目(51323060305);信息产业部电子第五研究所科技发展基金(XF0726130)资助
Author NameAffiliation
Lu Yudong Key Laboratory of Specially Functional Materials, Ministry of Education, South China University of Technology, Guangzhou 510640, China 
He Xiaoqi The 5th Electronics Research Institute of the Ministry of Information Industry, Guangzhou 510610, China 
En Yunfei The 5th Electronics Research Institute of the Ministry of Information Industry, Guangzhou 510610, China 
Wang Xin Key Laboratory of Specially Functional Materials, Ministry of Education, South China University of Technology, Guangzhou 510640, China 
Zhuang Zhiqiang Key Laboratory of Specially Functional Materials, Ministry of Education, South China University of Technology, Guangzhou 510640, China 
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Abstract:
      The content and distributing of P in Electroless Nickel/Immersion Gold (ENIG) surface finishes effect the reliability of interface between solder joint and surface finishes. 289 I/Os lead-free Sn-3.0Ag-0.5Cu BGAs was assembled on the ENIG print circuit board by reflow soldering technology. The print circuit board was tested by random vibration. After random vibration test, the failure and not failure samples were studied by X-ray, SEM, and EDX et al. The failure mechanism was confirmed and the relation of failure and content and distributing of P in ENIG finishes was discussed. The failure and not failure samples after vibration test show similar microstructure at the interface of solder joint and surface finishes. The cross-sectioning of the affected area shows a “tooth decay” effect of corrosion of the nickel layer, and “mud cracks” in the topography on the surface. The enrichment of P on the surface accelerated the oxidation of Ni, and also reduced the mechanical intensity of interface. The oxidation of Ni and the enrichment of P on the surface result in the crack of solder/finish interface