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杨超,王戎,郝娟,王迪,蒋百灵.镀料粒子脱靶方式对纯铝镀层微观组织的影响[J].稀有金属材料与工程(英文),2021,50(1):304~310.[YANG Chao,WANG Rong,HAO Juan,WANG Di and JIANG Bailing.Effect of escape-target method of deposited particles on microstructure of pure aluminum coating[J].Rare Metal Materials and Engineering,2021,50(1):304~310.]
Effect of escape-target method of deposited particles on microstructure of pure aluminum coating
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Received:January 19, 2020  
Key words: magnetron sputtering  aluminum coating  melt splashing  structure regulation  deposition rate
Foundation item:国家自然No. 51571114资助
Author NameAffiliation
YANG Chao,WANG Rong,HAO Juan,WANG Di and JIANG Bailing  
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      :For traditional magnetron sputtering, the sputtered species possessed low kinetic energy and ionization rate, which give rise to the metal coating formed columnar structure with micro pores, the coating therefore has poor compactness and adhesion strength. Aiming at this problem, the electric current through the anode and cathode was adjusted into the arc discharge transition region between the glow region and arc region of the gas discharge voltammetry curve in plasma physics. The escape energy of electron at the grain boundary and defect of the target is lower than that inside the grain, then theself-enhancing effectof electron escape is formed in grain boundary which induces the arc discharge phenomenon. Arc discharge melts some micro regions of the target surface, the plating particles in these regions will leave the target in the form of melt splashing. The high yield of melt splashing can improve the collisional ionization rate of the plating particles, which establish a foundation for the control of the coating structure. Experimental results show that: In the case of high frequency oscillating pulsed electric field, when the target current was gradually increased, the micro-morphology of the target surface gradually changed from Irregular pit-like morphology to round pit and curved ravine morphology, indicating that the off-target mode of the plating material changed from collision sputtering to melt splashing. When the target current was 2A, the species left the target by means of collision sputtering. The microstructure of the aluminum coating presented typical columnar structure with voids. When the target current increased to 14A, the off-target mode of the target particles was mainly melt splashing, massive ionized plating particles were accelerated under the negative bias of substrate. These ions with high kinetic energy enhanced bulk diffusion and weakened the tendency for column growth,which helped the coating form a dense structure. At the same time, the adhesion and the deposition rate of the coating were also significantly improved.