邹军涛,高磊,谢庭芳,李思林,孙利星,梁淑华.热压焊接制备的Cu / Al双金属的界面组织和剪切强度[J].稀有金属材料与工程,0,():-.[Juntao Zou,Lei Gao,Tingfang Xie,Silin Li,Lixing Sun,Shuhua Liang.Interfacial microstructure and shear strength of a Cu/Al bimetal fabricated by hot press welding[J].Rare Metal Materials and Engineering,0,():-].
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热压焊接制备的Cu / Al双金属的界面组织和剪切强度
投稿时间:2020-06-02  修订日期:2020-06-19
中文关键词:  铜铝双金属  界面微观结构  金属间化合物  剪切强度
基金项目:国家重点基础研究发展计划(973计划),国家自然科学基金项目(面上项目,重点项目,重大项目)
中文摘要:
      采用扩散焊(DFW)技术制备了Cu/Al双金属,连接温度范围683-803K,连接时间范围20-80min,连接压力15MPa。Cu/Al双金属界面处的SEM试验结果表明,随着焊接温度的升高和保温时间的延长,界面层厚度逐渐增加,在连接温度为803K,连接时间80min,Cu/Al界面处形成了Al4Cu9,Al3Cu4,AlCu、Al2Cu金属间化合物(从铜侧到铝侧),根据扩散动力学,金属间化合物(IMCS)的生成顺序为Al2Cu、Al4Cu9、AlCu、Al3Cu4。Cu / Al双金属的剪切试验显示为脆性断裂,并且界面强度随着IMC的减少而增加。在723 K的焊接温度下进行20分钟焊接后,Cu / Al双金属的剪切强度最高为63.8 MPa。
Interfacial microstructure and shear strength of a Cu/Al bimetal fabricated by hot press welding
英文关键词:Cu/Al bimetal  Interfacial microstructure  Intermetallic compounds  Shear strength
英文摘要:
      Cu/Al bimetals were fabricated by diffusion welding (DFW) at welding temperatures ranging between 683 and 803 K, welding time between 20 and 80 min, and a welding pressure of 15 MPa. The scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS) results of the Cu/Al interface showed that the width of interface layer gradually increased with increasing welding temperature and prolonged welding time. Following welding at 803 K for 80 min, intermetallic compounds (IMCs) of Al4Cu9, Al3Cu4, AlCu, and Al2Cu occurred at the Cu/Al interface from the copper side to the aluminum side. The IMCs occurred in the sequence of Al2Cu, AlCu, Al3Cu4, and Al4Cu9 . Shear test of Cu/Al bimetal showed brittle facture, and the interfacial strength increased with lower amount of IMCs. A maximum shear strength of the Cu/Al bimetal of 63.8 MPa was obtained following DFW at a welding temperature of 723 K for 20 min.
作者单位
邹军涛 陕西省电工材料与渗透技术重点实验室 
高磊 陕西省电工材料与渗透技术重点实验室 
谢庭芳 陕西省电工材料与渗透技术重点实验室 
李思林 陕西省电工材料与渗透技术重点实验室 
孙利星 陕西省电工材料与渗透技术重点实验室 
梁淑华 陕西省电工材料与渗透技术重点实验室 
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